Oxford Semiconductor receives best connectivity technology award

Award Recognizes Oxford ’s Innovation in Connectivity Solutions
for Embedded Systems

Milpitas, Calif., January 5, 2006 – Oxford Semiconductor, Inc., a leading provider of high performance connectivity solutions for consumer, storage, and multimedia applications, today announced that it was presented the Best Digital Portable Connectivity Semiconductor Technology award for its connectivity solutions. The award was announced at the 2005 Digital Portable Technology Summit held on November 23 in Shanghai, China.

The award was presented to Oxford Semiconductor at the annual event, which is organized by ChinaECNet and China InfoWorld. Award winners were selected by a readers’ poll survey jointly conducted with China InfoWorld.

“Oxford was selected for this award by an audience of its peers,” said ChinaECNet CEO, Dr. Wayne Chao. “Our membership consists of 250,000 members in the high technology and semiconductor manufacturing arenas. We were pleased to present this award to Oxford Semiconductor as they ranked very highly among our audience and have proven solutions that enable high performance connectivity that can be implemented quickly and easily.”

The Digital Portable Device Summit is intended to provide a comprehensive and comparative venue where digital portable device IC suppliers can present their technology and manufacturers can compare. ChinaECNet selected 300 consumer electronic engineers from its 250,000 members to attend the technology summit onsite, and an estimated 2,000 members attended online for the series of presentations made by speakers from major electronic IC suppliers. The presentations were broadcast in real-time nationwide in China. Oxford Semiconductor’s presentation, titled “USB Connectivity Solutions for Portable Digital Devices,” was delivered by the company’s product marketing director, Paul Liu.